Broadwell-H: 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for " all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats.For Broadwell-U models with integrated 5x00 GPUs, die size is 82 mm 2 with a total of 1.3 billion transistors, while for the models with 61 GPUs the die size is 133 mm 2 with a total of 1.9 billion transistors. The 2+2 configuration is scheduled for Q4 2014, while the 2+3 is estimated for Q1 2015. Maximum supported is up to 16 GB of DDR3 or LPDDR3 memory, with DDR3-1600 and LPDDR3-1867 as the maximum memory speeds. Designed to be used on motherboards with the PCH-LP chipset for Intel's ultrabook and NUC platforms. Broadwell-U: SoC two TDP classes – 15 W for 2+2 and 2+3 configurations (two cores with a GT2 or GT3 GPU) as well as 28 W for 2+3 configurations.TSX instructions are disabled in this series of processors because a bug that cannot be fixed with a microcode update exists. At Computex 2014, Intel announced that these chips would be branded as Core M. These were the first chips to roll out, in Q3/Q4 2014. GT2 GPU was used, while maximum supported memory is 8 GB of LPDDR3-1600.
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